Research on Building Wall Insulation Materials
A special issue of Buildings (ISSN 2075-5309). This special issue belongs to the section "Building Materials, and Repair & Renovation".
Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 4966
Special Issue Editor
Interests: life cycle assessment for energy systems; bio-based; recyclable matrices
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Due to the general need to reach the sustainable development goals, this Special Issue will promote the development of sustainable products (i.e., wood-based boards for wall panels, recycled materials, environmental friendly materials) and the application of the latest technology via the adoption of building information modeling (BIM), Internet of Things (IoT), and digital twin (DT) to optimize energy efficiency, energy recover, energy consumption, emissions, transportation, costs, etc. Green products and modern technology will contribute to the reduction of fossil fuel use, supporting circular economy measures. Thermal insulation, as well as acoustic and electromagnetic insulation properties, will be considered.
This Special Issue aims to generate more research interest in the development of multifunctional smart materials with reduced environmental impact and increased insulation properties, for more sustainable building.
Prof. Dr. Angela Daniela La Rosa
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Buildings is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thermal conductivity
- acoustic insulation
- electromagnetic interference shield
- natural fibers
- materials recycling
- life cycle assessment
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