Thermal Performance of the Building Envelope—Original Methods and Advanced Solutions
A special issue of Buildings (ISSN 2075-5309). This special issue belongs to the section "Building Energy, Physics, Environment, and Systems".
Deadline for manuscript submissions: closed (31 March 2024) | Viewed by 25041
Special Issue Editors
Interests: thermal bridges; hygrothermal simulation; building energy performance; thermal comfort; energy efficiency; renewable energy
Special Issues, Collections and Topics in MDPI journals
Interests: energy efficiency; energy audit; building energy simulation; highly efficient materials; renewable energy sources; BIPV
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
It is our pleasure to announce this Special Issue of Buildings, focused on the thermal performance of the building envelope. Indeed, it is our belief that a correct design of the building envelope, including an informed choice of the materials and their thermal properties, is a key requisite to conjugate energy efficiency, the durability of the envelope, and indoor microclimate.
This Special Issue encourages contributions regarding the latest research results, as well as good practice examples, about an improved thermal behaviour of the building envelope based both on experimental studies and on numerical simulation. Both original research papers and review papers are welcome. Topics of interest include but are not limited to:
- Techniques to measure heat losses in building components;
- Advanced solutions for thermal bridge correction;
- Hygrothermal performance of building materials;
- Mould growth: risks and solutions;
- Thermal inertia of the building envelope;
- Cool materials in buildings;
- Green roofs and green walls;
- Super insulating materials (i.e., vacuum insulation panels, gas-filled panels, and aerogel-based products);
- Nature-based and raw materials for the building envelope;
- Advanced transparent envelope components.
Prof. Dr. Gianpiero Evola
Prof. Dr. Elena Lucchi
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Buildings is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thermal bridges
- hygrothermal performance
- mould growth
- thermal inertia
- thermal insulation
- cool materials
- green roofs
- nature-based materials
- infrared thermography
- het flux meter measurements
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