Advances in Thermal Management and Reliability of Electronic Systems
A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "F: Electrical Engineering".
Deadline for manuscript submissions: 30 April 2026 | Viewed by 20
Special Issue Editor
Interests: bipolar transistors; power devices; photovoltaics; microelectronics; semiconductor devices
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
THERMINIC is the leading European workshop on thermal and reliability issues in electronic components and systems, and includes topics such as multiphysics simulation and modeling; thermal, thermo-mechanical, and reliability-related measurements; thermal characterization; and lifetime prediction issues.
For this Special Issue, we welcome submissions of updated versions of the papers presented at THERMINIC 2025 ,or indeed any paper (including those not presented at THERMINIC) related to the above topics.
Accepted and finalized papers will be published immediately in Energies.
Prof. Dr. Vincenzo d'Alessandro
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- electronic components and systems
- multiphysics simulation and modeling
- thermal characterization
- ther-mo-mechanical and reliability-tested measurements
- thermal resistance
- thermally-induced reliability degradation
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