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Advances in Materials Processing (3rd Edition)
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Advances in Materials Processing (3rd Edition)

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 20 December 2024 | Viewed by 4686

Special Issue Editor

Dr. Hansang Kwon

E-Mail Website
Guest Editor
Department of Material System Engineering, Pukyong National University, Busan 48513, Republic of Korea
Interests: nanomaterials; dissimilar materials; powder metallurgy; composite materials processing; functionally graded materials; surface modification; nanoparticles
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Since industrial development began, materials processing is central to the field of materials science and engineering, and is a vital step in manufacturing. Materials processing is an important process for realizing the structural features (e.g., crystal structure, microstructure, size, and shape) required for the product to perform well in the intended application by properly utilizing and designing the composition of a given material. It involves a complex series of chemical, thermal, and physical processes that prepare a starting material, create a shape, retain that shape, and refine the structure and shape. The conversion of the starting material to the final product occurs in three steps: preparation of the starting material, processing operation, and post-processing operation(s). Recently, trends in the high-tech industry are pushing toward miniaturization, the creation of products with complex shapes, and multi-functional materials. To keep up with ever-increasing demands, materials processing has been continuously advancing in terms of production, efficiency and performance qualification.

The main aim of the Special Issue is to discuss the topics of processing, manufacturing, structure/property relationship and applications in advanced materials. All of the single phase and alloy, and composite materials in metals, ceramics, and polymers are of interest.

It is our pleasure to invite you to submit a manuscript for this Special Issue.

Dr. Hansang Kwon
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • processing
  • manufacturing
  • powder metallurgy
  • processing of composite materials
  • surface modification
  • plasma synthesis
  • laser processing

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Related Special Issues

Published Papers (7 papers)

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Research

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13 pages, 1708 KiB  
Article
Development of a Mathematical Model of the Self-Shielded Flux-Cored Arc Surfacing Process for the Determination of Deposition Rate
by Michał Szymura, Artur Czupryński and Vladislav Ochodek
Materials 2024, 17(22), 5616; https://doi.org/10.3390/ma17225616 - 17 Nov 2024
Viewed by 309
Abstract
The article presents a method of developing a mathematical model of the arc surfacing process performed using the self-shielded flux-cored filler metal wire with the chromium cast iron (Fe15) weld deposit. A three-level design (static, determined, and complete) was used to determine the [...] Read more.
The article presents a method of developing a mathematical model of the arc surfacing process performed using the self-shielded flux-cored filler metal wire with the chromium cast iron (Fe15) weld deposit. A three-level design (static, determined, and complete) was used to determine the function of the test object, thus enabling the simulation of deposition rate in relation to wire feed speed and electrode extension. The deposition rate for the specified set of surfacing parameters amounted to between 4.31 kg/h and 11.25 kg/h. The study was also concerned with identifying the effect of the significance level of test factors and interactions between them on the resultant factor, as well as an assessment of the adequacy of the test object function. In relation to significance level α = 0.01, regression coefficients b0, b1, b2, and b11 significantly affected the deposition rate of the surfacing process. Coefficient b22 was significant at a level of 0.40, whereas coefficient b12 was significant at a level of 0.15. The mathematical model presenting the effect of wire feed speed and electrode extension, as well as interactions between them on the deposition rate of the surfacing process, was adequate for the adopted level of significance α = 0.05. Full article
(This article belongs to the Special Issue Advances in Materials Processing (3rd Edition))
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10 pages, 2387 KiB  
Article
Controlled Formation of Porous Cross-Bar Arrays Using Nano-Transfer Printing
by Yu Na Kim, Eun Bin Kang, Tae Wan Park and Woon Ik Park
Materials 2024, 17(22), 5609; https://doi.org/10.3390/ma17225609 - 16 Nov 2024
Viewed by 378
Abstract
Nano-transfer printing (nTP) has emerged as an effective method for fabricating three-dimensional (3D) nanopatterns on both flat and non-planar substrates. However, most transfer-printed 3D patterns tend to exhibit non-discrete and/or non-porous structures, limiting their application in high-precision nanofabrication. In this study, we introduce [...] Read more.
Nano-transfer printing (nTP) has emerged as an effective method for fabricating three-dimensional (3D) nanopatterns on both flat and non-planar substrates. However, most transfer-printed 3D patterns tend to exhibit non-discrete and/or non-porous structures, limiting their application in high-precision nanofabrication. In this study, we introduce a simple and versatile approach to produce highly ordered, porous 3D cross-bar arrays through precise control of the nTP process parameters. By selectively adjusting the polymer solution concentration and spin-coating conditions, we successfully generated discrete, periodic line patterns, which were then stacked at a 90-degree angle to form a porous 3D cross-bar structure. This technique enabled the direct transfer printing of PMMA line patterns with well-defined, square-arrayed holes, without requiring additional deposition of functional materials. This method was applied across diverse substrates, including planar Si wafers, flexible PET, metallic copper foil, and transparent glass, demonstrating its adaptability. These well-defined 3D cross-bar patterns enhance the versatility of nTP and are anticipated to find broad applicability in various nano-to-microscale electronic devices, offering high surface area and structural precision to support enhanced functionality and performance. Full article
(This article belongs to the Special Issue Advances in Materials Processing (3rd Edition))
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22 pages, 7689 KiB  
Article
Influence of SS316L Nanoparticles on the Sintered Properties of Two-Component Micro-Powder Injection Moulded Bimodal SS316L/Zirconia Bi-Materials
by Al Basir, Abu Bakar Sulong, Norhamidi Muhamad, Afifah Z. Juri, Nashrah Hani Jamadon, Farhana Mohd Foudzi, Nabilah Afiqah Mohd Radzuan and Kambiz Rashidi
Materials 2024, 17(22), 5536; https://doi.org/10.3390/ma17225536 - 13 Nov 2024
Viewed by 355
Abstract
Two-component micro-powder injection moulding (2C-μPIM) is a prospective approach for fabricating bi-material micro-components of stainless steel 316L (SS316L) and 3 mol% yttria-stabilised zirconia (3YSZ) at an appealing cost. However, the fundamental challenge lies in preventing the formation of large-scale cracks at the interface [...] Read more.
Two-component micro-powder injection moulding (2C-μPIM) is a prospective approach for fabricating bi-material micro-components of stainless steel 316L (SS316L) and 3 mol% yttria-stabilised zirconia (3YSZ) at an appealing cost. However, the fundamental challenge lies in preventing the formation of large-scale cracks at the interface of two different materials during sintering. This study investigated how SS316L nanoparticles in bimodally configured SS316L powder that incorporated both nanoparticles and microparticles influenced the sintering of 2C-μPIM-processed miniature bi-materials made of bimodal SS316L and 3YSZ. In this study, feedstocks were developed by integrating monomodal (micro-sized) SS316L powder, three types of nano/micro-bimodal SS316L powders, and 3YSZ powder individually with palm stearin and low-density polyethylene binders. The results indicated that increasing the SS316L nanoparticle content to 45 vol.% caused a 19.5% increase in the critical powder loading in the bimodal SS316L powder as compared to that in the monomodal SS316L powder. The addition of SS316L nanoparticles increased the relative density and hardness of the sintered bi-materials, with the maximum values obtained being 96.8% and 1156.8 HV, respectively. Field emission scanning electron microscopy investigations revealed that adding 15 vol.% and 30 vol.% SS316L nanoparticle contents reduced interface cracks in bi-materials significantly, while 45 vol.% resulted in a crack-free interface. Full article
(This article belongs to the Special Issue Advances in Materials Processing (3rd Edition))
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24 pages, 21789 KiB  
Article
Estimation of Quality of Seam Welds in AlMgSi(Cu) Extrusion by Using an Original Device for Weldability Testing
by Marek Bogusz, Dariusz Leśniak, Józef Zasadziński, Wojciech Libura, Beata Leszczyńska-Madej, Jacek Madura, Tomasz Latos, Kamila Limanówka and Bartłomiej Płonka
Materials 2024, 17(22), 5448; https://doi.org/10.3390/ma17225448 - 7 Nov 2024
Viewed by 542
Abstract
Extrusion welding of AlMgSi(Cu) alloys is carried out by using porthole dies, as a result of which hollow shapes are formed with longitudinal seam welds. In the case of the inappropriate selection of the chemical composition of the aluminium alloy or improper metal [...] Read more.
Extrusion welding of AlMgSi(Cu) alloys is carried out by using porthole dies, as a result of which hollow shapes are formed with longitudinal seam welds. In the case of the inappropriate selection of the chemical composition of the aluminium alloy or improper metal welding conditions, the weld may have reduced strength in relation to that of the base material, thus weakening the strength of structures based on aluminium extrudates. The prediction of metal welding conditions, depending on the chemical composition of the alloy, the temperature and the unit welding pressures, effectively supports the design of porthole dies, thus significantly reducing the number of necessary extrusion tests and die geometry corrections needed during its implementation in industrial practice, and consequently significantly reducing production costs. In this work, an original laboratory test device simulating the behaviour of metal in a welding chamber of a porthole die was applied to examine the ability of AlMgSi(Cu) alloys to produce high-quality joints. Two different chemical compositions of AlMgSi(Cu) aluminium alloys differing in Mg, Si and Cu contents were used: alloy no. 1A (0.68% wt. Mg, 1.04% wt. Si, 0.61% wt. Cu) and alloy no. 3A (0.8% wt. Mg, 1.21% wt. Si, 1.22% wt. Cu). The weldability tests were carried out under various welding temperatures of 450, 500 and 550 °C and under various welding pressures of 150 MPa, 250 MPa and 350 MPa. The microstructural changes in the produced welds were evaluated with the use of OM and SEM/EDS with chemical analysis in micro-areas, whereas the mechanical effects were evaluated by using a static tensile test. Samples after static tensile testing were subjected to fractographic tests to determine the nature of the fractures. The highest values of relative weld strength were obtained under the highest welding temperature of 550 °C and the highest unit welding pressure of 350 MPa: 87% for alloy number 1/1A (high-strength weld), and 62% for alloy number 6/3A (medium-strength weld). Finally, the extrusion tests were performed in industrial conditions with an examination of the EBSD structure and strength of the longitudinal welds. High values of relative weld strength for extrudates from alloy no. 1/1A and alloy no. 3A, 96% and 89%, respectively, were found, which confirmed the previous weldability testing results. Full article
(This article belongs to the Special Issue Advances in Materials Processing (3rd Edition))
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13 pages, 2233 KiB  
Article
Optimization of Ceramic Paste Composition for 3D Printing via Robocasting
by Szymon Przybyła, Maciej Kwiatkowski, Michał Kwiatkowski and Marek Hebda
Materials 2024, 17(18), 4560; https://doi.org/10.3390/ma17184560 - 17 Sep 2024
Viewed by 884
Abstract
This article presents a procedure for selecting optimal ceramic paste formulations dedicated to the 3D printing process using robocasting technology. This study investigated pastes with varying ceramic powder particle sizes and different proportions of additives, such as ceramic microspheres and nutshells. This selection [...] Read more.
This article presents a procedure for selecting optimal ceramic paste formulations dedicated to the 3D printing process using robocasting technology. This study investigated pastes with varying ceramic powder particle sizes and different proportions of additives, such as ceramic microspheres and nutshells. This selection process allowed for the classification of ceramic mixtures into those suitable and unsuitable for this additive manufacturing technique. Subsequently, the viscosity of the pastes was measured, and extrudability tests were performed to determine the force required for extrusion and evaluate the quality of the extruded material. In the final stage, the setting time of the ceramic pastes was assessed to establish the drying time of the printed elements. It was found that the length of the extruded band of ceramic paste was inversely proportional to the Al₂O₃ content. Moreover, the extrusion force for samples with varying ceramic powder particle sizes (MG1–MG5) ranged from 133 to 166 N, compared to 77 N for the base sample (BM1). The obtained results enable further development in robocasting additive technology, including the development of a rapid and effective method for validating ceramic pastes used in this process. Full article
(This article belongs to the Special Issue Advances in Materials Processing (3rd Edition))
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16 pages, 8371 KiB  
Article
Influence of Severe Plastic Deformation and Aging on Low Cycle Fatigue Behavior of Al-Mg-Si Alloys
by Wonhoe Kim, Kibeom Kim and Kwonhoo Kim
Materials 2024, 17(9), 2148; https://doi.org/10.3390/ma17092148 - 3 May 2024
Cited by 1 | Viewed by 1114
Abstract
Strain-controlled low cycle fatigue (LCF) tests were conducted on conventionally grained (CG) and ultrafine-grained (UFG) Al-Mg-Si alloys treated under various aging conditions. In the cyclic stress response (CSR) curves, CG peak-aged (PA) alloys showed initial cyclic hardening and subsequent saturation, whereas CG over-aged [...] Read more.
Strain-controlled low cycle fatigue (LCF) tests were conducted on conventionally grained (CG) and ultrafine-grained (UFG) Al-Mg-Si alloys treated under various aging conditions. In the cyclic stress response (CSR) curves, CG peak-aged (PA) alloys showed initial cyclic hardening and subsequent saturation, whereas CG over-aged (OA) alloys displayed cyclic softening behavior close to saturation. The UFG materials exhibited continuous cyclic softening except for UFG 3; it originates from the microstructural stability of the UFG materials processed by severe plastic deformation (SPD). Using a strain-based criterion, the LCF behavior and life of the CG and UFG materials were analyzed and evaluated; the results are discussed in terms of strengthening mechanisms and microstructural evolution. In the CG materials, the LCF life changed markedly owing to differences in deformation inhomogeneity depending on the precipitate state. However, the UFG materials displayed a decreasing LCF life as cyclic softening induced by dynamic recovery became more severe; additionally, a relationship between the microstructural stability of the UFG materials and the cyclic strain hardening exponent n′ was suggested. Full article
(This article belongs to the Special Issue Advances in Materials Processing (3rd Edition))
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Review

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20 pages, 4572 KiB  
Review
Device Applications Enabled by Bandgap Engineering Through Quantum Dot Tuning: A Review
by Ho Kyung Lee, Taehyun Park and Hocheon Yoo
Materials 2024, 17(21), 5335; https://doi.org/10.3390/ma17215335 - 31 Oct 2024
Viewed by 395
Abstract
Quantum dots (QDs) are becoming essential materials for future scientific and real-world applications, owing to their interesting and distinct optical and electrical properties compared to their bulk-state counterparts. The ability to tune the bandgap of QDs based on size and composition—a key characteristic—opens [...] Read more.
Quantum dots (QDs) are becoming essential materials for future scientific and real-world applications, owing to their interesting and distinct optical and electrical properties compared to their bulk-state counterparts. The ability to tune the bandgap of QDs based on size and composition—a key characteristic—opens up new possibilities for enhancing the performance of various optoelectronic devices. These advances could extend to cutting-edge applications such as ultrawide-band or dual-band photodetectors (PDs), optoelectronic logic gates, neuromorphic devices, and security functions. This paper revisits the recent progress in QD-embedded optoelectronic applications, focusing on bandgap tunability. The current limitations and challenges in advancing and realizing QD-based optoelectronic devices are also discussed. Full article
(This article belongs to the Special Issue Advances in Materials Processing (3rd Edition))
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