Green & Intelligent Printing or Packaging Materials in Light Industry
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Composites".
Deadline for manuscript submissions: closed (20 May 2023) | Viewed by 5677
Special Issue Editors
Interests: sensors; conductive material; printed electronics; intelligent packaging
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Intelligent packaging has great potential to improve the safety, quality and traceability of products and increase convenience for consumers. Flexible electronic sensors, which play a key role in intelligent packaging, have seen major advancements over the last few years due to their excellent conductivity, portable and facile fabrication. Owing to the poor durability and stability of sensors, their widespread application is limited. Sensors based on two-dimensional conductive materials are sensitive to strain changes in tension or pressure, leading to changes in their conductivity or resistance when external pressure is applied. Compared with traditional sensors based on metals, flexible electronic materials have excellent tensile properties. With the development of flexible electronic technology, microelectronic devices have evolved from rigid to wearable, with flexible and integrable patterns. Currently, there are challenges related to the design of sensors that are stable in practice yet susceptible to mechanical attack during use. Sensors intended for specific applications must not only perform different functions but must also meet acceptable standards of durability during use and exhibit interfacial stability.
Various biomimetic, functional and conductive materials are used in intelligent packaging. In recent years, ensuring the safety of packaging contents in the transportation process has attracted extensive attention, especially for items with significant value, which presents a significant challenge. Many technologies have been applied in packaging, such as radio frequency identification (RFID) technology, infrared induction technology and global positioning systems (GPSs). In the coming years, an increase in functional material-based sensors is expected, as well as increased market demand for flexible sensors due to new possibilities in intelligent packaging can be realized by printing conductive ink directly on packaging products, and smart packaging could be achieved through integrating sensors into packaging via structural design.
In this Special Issue, we aim to present a contemporary overview of recent developments in the fields of green printing, printed electronics and intelligent packaging. Reviews, full papers and short communications covering current trends in the expansion of polymeric material applications are all welcome.
The scope of this issue includes, but is not limited to, the following topics:
- Green preparation of environmentally friendly materials in printing and packaging;
- Recycling of waste packaging materials, such as plastic, metal, paper, etc.;
- Functional materials, including electric, optical, thermal resistance, magnetic, hydrophobic materials, etc.;
- The green fabrication technologies for preparation of smart devices;
- Reusing natural materials, such as lignin, cellulose, protein, etc.;
- Calculation and simulation technologies for material and device preparation.
Dr. Xing Zhou
Guest Editor
Dr. Dong Wang
Guest Editor Assistant
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Keywords
- environmentally friendly materials
- green fabrication
- recycling
- multiple functions
- simulation
- printing and packaging
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