High-Performance Additive Manufacturing and Welding of Metals and Alloys
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".
Deadline for manuscript submissions: 20 February 2025 | Viewed by 3660
Special Issue Editors
Interests: additive manufacturing; welding; microstructural evolution; diffusion bonding; residual stress; fatigue strength
Special Issues, Collections and Topics in MDPI journals
Interests: advanced packaging; copper paste; die attach; pressureless sintering; high-pressure
Interests: material processing; composites; alloys; advanced materials; microstructures; nanomaterials; combustion synthesis
Special Issues, Collections and Topics in MDPI journals
Interests: cold spray; laser; brazing; additive manufacturing; large deformation; grain refinement; mechanical property; modeling
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Additive manufacturing (AM) is a key technique driving Industry 4.0. In the era of Industry 4.0, AM/Welding is emerging as a valuable digital technique that offers virtually limitless possibilities for manufacturing (from tools to mass customization) in all industries. To date, AM and welding have been extensively researched. Various fusion-based AM/welding techniques that feature electric arcs, lasers, or electron beams as the heat source to build objects through material melting/solidification have become mainstream. In order to minimize solidification-related problems, in recent years, many solid-state AM/welding techniques (e.g., based on cold spraying or friction processing) have been proposed, attracting great attention from both scientific and industrial communities. Moreover, AM/welding focusing on the metals and alloys is also of great interest.
There is an increasing focus on the research and development of novel die attach materials that exhibit high-temperature reliability and can be specifically tailored to the unique requirements of WBG devices.
This Special Issue will consist of high-quality original research papers related to the following overlapping fields:
- High-performance computing;
- Artificial intelligence, machine learning, and deep learning;
- Microstructure evolution;
- Mechanical properties;
- The measurement and analysis of residual stress;
- Process–microstructure–performance relationships;
- Modeling;
- Additive manufacturing and the welding of high-performance parts;
- The future prospects of additive manufacturing and welding.
- Developing and enhancing the properties of copper pastes;
- Processes for 3D high-density packaging.
Dr. Junmiao Shi
Dr. Ran Liu
Dr. Guangjie Feng
Dr. Qian Wang
Guest Editors
Manuscript Submission Information
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Keywords
- additive manufacturing
- welding
- arc
- laser
- cold spray
- friction
- brazing
- microstructure
- mechanical property
- residual stress
- modeling
- wide bandgap (WBG)
- advanced packaging
- power device
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