New Perspectives in Ultra Precision Manufacturing and Micro-Nano Inspection Technology

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanophotonics Materials and Devices".

Deadline for manuscript submissions: 20 July 2025 | Viewed by 299

Special Issue Editors


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Guest Editor
College of Intelligent Science and Technology, National University of Defense Technology, Changsha 410073, China
Interests: ultra precision polishing; ion beam polishing; magnetorheological finishing; defect detection; AR; precision engineering; ultra smooth; advanced optical fabrication; low damage
College of Intelligent Science and Technology, National University of Defense Technology, Changsha 410073, China
Interests: defect inspection; optical design; illumination design; machine vision; image processing
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Special Issue Information

Dear Colleagues,

The ultra-precision manufacturing and micro-nano inspection technology field has witnessed remarkable advancements in recent years, driven by the escalating demand for high-performance optical systems across various applications. Innovations in materials science, fabrication methodologies, and sophisticated measurement techniques have enabled researchers to explore novel ultra-precision manufacturing and inspection approaches that potentially revolutionize this field. This Special Issue on "New Perspectives in Ultra Precision Manufacturing and Micro-Nano Inspection Technology" showcases the latest research and developments, highlighting pioneering concepts, methodologies, and practical applications. Key areas covered in this Special Issue include, but are not limited to, ultra-precision polishing, advanced materials, precision manufacturing techniques, computational methods and algorithms, ion beam polishing, magnetorheological finishing, ultra smooth, low damage, measurement and metrology, optical design, integrated optoelectronic devices, machine vision, and defect detection.

We believe this collection of articles will be an invaluable resource for professionals seeking to advance the frontiers of ultra-precision manufacturing and micro-nano inspection technology. We hope it will inspire further innovation and foster collaboration among scientists, researchers, and engineers, ultimately leading to new perspectives and breakthroughs in this field.

Both theoretical and experimental studies and comprehensive reviews and survey papers are welcome.

Prof. Dr. Feng Shi
Dr. Xing Peng
Guest Editors

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Keywords

  • ultra precision polishing
  • advanced materials
  • ion beam polishing
  • magnetorheological finishing
  • ultra smooth
  • low damage
  • machine vision
  • defect detection
  • measurement and metrology
  • optical design
  • integrated optoelectronic devices

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Published Papers (1 paper)

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Research

11 pages, 5221 KiB  
Article
Green Chemical Shear-Thickening Polishing of Monocrystalline Silicon
by Jiancheng Xie, Feng Shi, Shanshan Wang, Xing Peng and Qun Hao
Nanomaterials 2024, 14(23), 1866; https://doi.org/10.3390/nano14231866 - 21 Nov 2024
Viewed by 168
Abstract
A green chemical shear-thickening polishing (GC-STP) method was studied to improve the surface precision and processing efficiency of monocrystalline silicon. A novel green shear-thickening polishing slurry composed of silica nanoparticles, alumina abrasive, sorbitol, plant ash, polyethylene glycol, and deionized water was formulated. The [...] Read more.
A green chemical shear-thickening polishing (GC-STP) method was studied to improve the surface precision and processing efficiency of monocrystalline silicon. A novel green shear-thickening polishing slurry composed of silica nanoparticles, alumina abrasive, sorbitol, plant ash, polyethylene glycol, and deionized water was formulated. The monocrystalline silicon was roughly ground using a diamond polishing slurry and then the GC-STP process. The material removal rate (MRR) during GC-STP was 4.568 μmh−1. The material removal mechanism during the processing of monocrystalline silicon via GC-STP was studied using elemental energy spectroscopy and FTIR spectroscopy. After 4 h of the GC-STP process, the surface roughness (Ra) of the monocrystalline silicon wafer was reduced to 0.278 nm, and an excellent monocrystalline silicon surface quality was obtained. This study shows that GC-STP is a green, efficient, and low-damage polishing method for monocrystalline silicon. Full article
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