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Photonics
Special Issues
Advanced Photonic Integration Technology and Devices
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Advanced Photonic Integration Technology and Devices

A special issue of Photonics (ISSN 2304-6732).

Deadline for manuscript submissions: 30 April 2025 | Viewed by 809

Special Issue Editor

Dr. Wei Du

E-Mail Website
Guest Editor
Department of Electrical Engineering and Computer Science, University of Arkansas, Fayetteville, AR 72701, USA
Interests: photonics integrated circuits; Si photonics; nanotechnology

Special Issue Information

Dear Colleagues,

Due to their superior performance, energy efficiency, and versatility in a wide range of applications, photonic integrated circuits (PICs) have attracted increasing attention in the post-Moore law era. With the emergence of photonic computing, traditional electronic-based printed circuit boards and ICs with optoelectronic circuits may be eventually replaced by large-scale PICs. Currently, the use of PICs n InP, Silicon Photonics, and TriPleX™ platforms has been widely reported, exhibiting significant progress in the development of PICs. However, designing a PIC requires challenges that are much different to those of a typical electronic IC to be met. The future demand for a high-performance and reliable system calls for a novel paradigm that will significantly enhance computational and data processing capacities.

This Special Issue aims to showcase PIC design strategies and the diverse development of multifunctional devices including active and passive components. All relevant theoretical designs, numerical calculations, and experimental papers will be accepted. The scope of this Special Issue includes, but is not limited to, the following topics:

  • Novel photonic integrated circuits platforms;
  • Novel photonic integration design strategies;
  • Photonic integrated circuits on Si photonics platform;
  • Photonic integrated circuits on group III-V platform;
  • Modeling of PIC systems;
  • Modeling of optoelectronic devices;
  • High-performance lasers and photodetectors;
  • EO and EA modulators towards photonic integration;
  • Development of passive devices;
  • PIC for quantum computing applications.

Dr. Wei Du
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • photonics integrated circuits
  • optoelectronics
  • Si photonics
  • hybrid integration

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Further information on MDPI's Special Issue polices can be found here.

Published Papers (1 paper)

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Research

11 pages, 2094 KiB  
Article
Highly Efficient Polarization-Insensitive Grating Couplers on Thin-Film Lithium Niobate with an Integrated Gold Layer
by Alaa Sultan, Mostafa Khalil, Leila Mehravar and Chang-qing Xu
Photonics 2025, 12(2), 111; https://doi.org/10.3390/photonics12020111 - 27 Jan 2025
Viewed by 438
Abstract
The thin-film lithium niobate platform, which is emerging as a promising photonic integration platform, currently lacks a polarization-insensitive grating coupler (GC), a crucial component for polarization-independent fiber interfaces. This limitation restricts its use in many applications, such as polarization-insensitive modulation systems and polarization [...] Read more.
The thin-film lithium niobate platform, which is emerging as a promising photonic integration platform, currently lacks a polarization-insensitive grating coupler (GC), a crucial component for polarization-independent fiber interfaces. This limitation restricts its use in many applications, such as polarization-insensitive modulation systems and polarization management. In this study, we propose a polarization-insensitive nonuniform GC, achieved by intersecting optimal TE- and TM-mode grating periods. Based on our simulation results, the proposed design delivers a coupling efficiency (CE) of 80% for TE and 78.5% for TM polarization, with a polarization-dependent loss of less than 0.14 dB at a wavelength of 1550 nm. The inserted gold layer, i.e., that inside the substrate layer, boosts the CEs of the optimal TE- and TM-mode GC by about 50%, resulting in a highly efficient, polarization-insensitive solution. This advancement enables on-chip polarization diversity applications on the thin-film lithium niobate platform. We also investigate the fabrication and alignment tolerances of the proposed design to ensure robust performance under practical conditions. Full article
(This article belongs to the Special Issue Advanced Photonic Integration Technology and Devices)
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