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Photonics
Special Issues
Progress in Integrated Photonics and Future Prospects
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Progress in Integrated Photonics and Future Prospects

A special issue of Photonics (ISSN 2304-6732). This special issue belongs to the section "Optoelectronics and Optical Materials".

Deadline for manuscript submissions: closed (20 November 2024) | Viewed by 4807

Special Issue Editors

Dr. Kaiyi Wu

E-Mail Website
Guest Editor
School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA
Interests: integrated photonics for nonlinear and quantum optics; silicon photonic devices; micro/nano-fabrication
Dr. Mengyue Xu

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, University of Michigan, Ann Arbor, MI 48109, USA
Interests: integrated photonics; optical communications; thin-film lithium niobate photonics; heterogenous photonics

Special Issue Information

Dear Colleagues,

Integrated photonics is captivating due to its ability to shrink discrete bulk modules to the chip scale, offering a scalable solution for sensing, signaling, processing, and computing. A smaller footprint presents numerous benefits, including enhanced efficiency, reduced loss, and intensified light–matter interactions. Over the years, Photonics-Integrated Circuits (PICs) have been explored across various platforms like silicon (Si), silicon nitride (SiN), thin-film lithium niobate (TFLN), indium phosphide (InP), and AlGaAs-on-insulators (AlGaAsOIs). Each platform offers unique advantages; for instance, Si photonics benefits from mature CMOS facilities and is optimized for high-density integration, while TFLN and InP excel in ultra-high-speed modulation but are less friendly for mass production. The journey to uncover high-performance, multifunctional PICs on both monolithic and hybrid/heterogeneous photonics platforms remains ever-evolving.

We are pleased to invite contributions to this Special Issue of Photonics, entitled “Progress in Integrated Photonics and Future Prospects”. This Special Issue aims to highlight the recent advancements in photonics-integrated devices and circuits, focusing on innovative design methodologies, fabrication techniques, characterizations of device/PICs performance, and evaluations of system performance with devices or PICs. We welcome work in the form of reviews, articles, and perspectives. Research areas may include (but are not limited to) the following:

  • Photonics integrated circuits (PICs) or device for on-chip light generation, routing, processing, detection, modulation, and computing;
  • Hybrid and heterogeneous integration photonics technology;
  • Nanofabrication on integrated platforms such as Si, SiN, TFLN, InP, and AlGaAsOI;
  • Innovative design models and strategies for integrated photonics.

Dr. Kaiyi Wu
Dr. Mengyue Xu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • integrated photonics
  • photonics integrated circuits (PICs)
  • thin-film photonics
  • monolithic photonics integration
  • hybrid/heterogenous photonics integration
  • integrated quantum photonics
  • integrated nonlinear photonics
  • nanofabrication
  • inverse design for integrated photonics

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Published Papers (4 papers)

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Research

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30 pages, 13607 KiB  
Article
Grating Coupler Design for Low-Cost Fabrication in Amorphous Silicon Photonic Integrated Circuits
by Daniel Almeida, Paulo Lourenço, Alessandro Fantoni, João Costa and Manuela Vieira
Photonics 2024, 11(9), 783; https://doi.org/10.3390/photonics11090783 - 23 Aug 2024
Viewed by 908
Abstract
Photonic circuits find applications in biomedicine, manufacturing, quantum computing and communications. Photonic waveguides are crucial components, typically having cross-section orders of magnitude inferior when compared with other photonic components (e.g., optical fibers, light sources and photodetectors). Several light-coupling methods exist, consisting of either [...] Read more.
Photonic circuits find applications in biomedicine, manufacturing, quantum computing and communications. Photonic waveguides are crucial components, typically having cross-section orders of magnitude inferior when compared with other photonic components (e.g., optical fibers, light sources and photodetectors). Several light-coupling methods exist, consisting of either on-plane (e.g., adiabatic and end-fire coupling) or off-plane methods (e.g., grating and vertical couplers). The grating coupler is a versatile light-transference technique which can be tested at wafer level, not requiring specific fiber terminations or additional optical components, like lenses, polarizers or prisms. This study focuses on fully-etched grating couplers without a bottom reflector, made from hydrogenated amorphous silicon (a-Si:H), deposited over a silica substrate. Different coupler designs were tested, and of these we highlight two: the superimposition of two lithographic masks with different periods and an offset between them to create a random distribution and a technique based on the quadratic refractive-index variation along the device’s length. Results were obtained by 2D-FDTD simulation. The designed grating couplers achieve coupling efficiencies for the TE-like mode over −8 dB (mask overlap) and −3 dB (quadratic variation), at a wavelength of 1550 nm. The coupling scheme considers a 220 nm a-Si:H waveguide and an SMF-28 optical fiber. Full article
(This article belongs to the Special Issue Progress in Integrated Photonics and Future Prospects)
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8 pages, 1987 KiB  
Article
Low-Power-Consumption and Broadband 16-Channel Variable Optical Attenuator Array Based on Polymer/Silica Hybrid Waveguide
by Shengyuan Zhang, Yuexin Yin, Zihao Wang, Yafan Li, Yuan Zhang, Mengke Yao, Daming Zhang and Ye Li
Photonics 2024, 11(6), 547; https://doi.org/10.3390/photonics11060547 - 8 Jun 2024
Cited by 1 | Viewed by 1180
Abstract
A variable optical attenuator (VOA) is a crucial component for optical communication, especially for a variable multiplexer (VMUX) and reconfigurable optical add-drop multiplexer (ROADM). With the capacity increasing dramatically, a large-port-count and low-power-consumption VOA array is urgent for an on-chip system. In this [...] Read more.
A variable optical attenuator (VOA) is a crucial component for optical communication, especially for a variable multiplexer (VMUX) and reconfigurable optical add-drop multiplexer (ROADM). With the capacity increasing dramatically, a large-port-count and low-power-consumption VOA array is urgent for an on-chip system. In this paper, we experimentally demonstrate a 16-channel VOA array based on a polymer/silica hybrid waveguide. The proposed array is able to work over C and L bands. The VOA array shows an average attenuation larger than 14.38 dB with a low power consumption of 15.53 mW. The low power consumption makes it possible to integrate silica-based passive devices with a large port count on-chip. Full article
(This article belongs to the Special Issue Progress in Integrated Photonics and Future Prospects)
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7 pages, 1806 KiB  
Article
GeAsSeTe/GeAsSe Pedestal Waveguides for Long-Wave Infrared Tunable on-Chip Spectroscopy
by Vasileios Mourgelas, Sirawit Boonsit, James Shafto Wilkinson and Ganapathy Senthil Murugan
Photonics 2024, 11(3), 201; https://doi.org/10.3390/photonics11030201 - 24 Feb 2024
Viewed by 1075
Abstract
A dry-etched pedestal chalcogenide waveguide platform, designed for use in long-wave IR spectrometer applications, is demonstrated, fabricated and optically characterized. The optical layers were deposited on pre-patterned dry-etched silicon pedestals. An exceptionally low waveguide propagation loss was measured, at around 0.1 dB/cm at [...] Read more.
A dry-etched pedestal chalcogenide waveguide platform, designed for use in long-wave IR spectrometer applications, is demonstrated, fabricated and optically characterized. The optical layers were deposited on pre-patterned dry-etched silicon pedestals. An exceptionally low waveguide propagation loss was measured, at around 0.1 dB/cm at λ = 10 μm. The modal thermo-optic coefficient of the waveguide was experimentally estimated to be approximately 1.1 × 10−4 C−1 at λ = 1.63 μm, which is comparable to that of Si and GaAs. Waveguide spiral interferometers were fabricated, proving the potential for realization of more complex, chalcogenide-based, integrated photonic circuits. The combination of low propagation losses and a strong thermo-optic coefficient makes this platform an ideal candidate for utilization in on-chip tunable spectrometers in the long-wave IR wavelength band. Full article
(This article belongs to the Special Issue Progress in Integrated Photonics and Future Prospects)
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Review

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26 pages, 11735 KiB  
Review
Silicon Carbide Microring Resonators for Integrated Nonlinear and Quantum Photonics Based on Optical Nonlinearities
by Qianni Zhang, Jiantao Wang and Andrew W. Poon
Photonics 2024, 11(8), 701; https://doi.org/10.3390/photonics11080701 - 28 Jul 2024
Viewed by 1039
Abstract
Silicon carbide (SiC) electronics has seen a rapid development in industry over the last two decades due to its capabilities in handling high powers and high temperatures while offering a high saturated carrier mobility for power electronics applications. With the increased capacity in [...] Read more.
Silicon carbide (SiC) electronics has seen a rapid development in industry over the last two decades due to its capabilities in handling high powers and high temperatures while offering a high saturated carrier mobility for power electronics applications. With the increased capacity in producing large-size, single-crystalline SiC wafers, it has recently been attracting attention from academia and industry to exploit SiC for integrated photonics owing to its large bandgap energy, wide transparent window, and moderate second-order optical nonlinearity, which is absent in other centrosymmetric silicon-based material platforms. SiC with various polytypes exhibiting second- and third-order optical nonlinearities are promising for implementing nonlinear and quantum light sources in photonic integrated circuits. By optimizing the fabrication processes of the silicon carbide-on-insulator platforms, researchers have exploited the resulting high-quality-factor microring resonators for various nonlinear frequency conversions and spontaneous parametric down-conversion in photonic integrated circuits. In this paper, we review the fundamentals and applications of SiC-based microring resonators, including the material and optical properties, the device design for nonlinear and quantum light sources, the device fabrication processes, and nascent applications in integrated nonlinear and quantum photonics. Full article
(This article belongs to the Special Issue Progress in Integrated Photonics and Future Prospects)
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