Geng, W.; Yang, X.; Xue, G.; Xu, W.; Bi, K.; Mei, L.; Zhang, L.; Hou, X.; Chou, X.
Integration Technology for Wafer-Level LiNbO3 Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing. Nanomaterials 2021, 11, 2554.
https://doi.org/10.3390/nano11102554
AMA Style
Geng W, Yang X, Xue G, Xu W, Bi K, Mei L, Zhang L, Hou X, Chou X.
Integration Technology for Wafer-Level LiNbO3 Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing. Nanomaterials. 2021; 11(10):2554.
https://doi.org/10.3390/nano11102554
Chicago/Turabian Style
Geng, Wenping, Xiangyu Yang, Gang Xue, Wenhao Xu, Kaixi Bi, Linyu Mei, Le Zhang, Xiaojuan Hou, and Xiujian Chou.
2021. "Integration Technology for Wafer-Level LiNbO3 Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing" Nanomaterials 11, no. 10: 2554.
https://doi.org/10.3390/nano11102554
APA Style
Geng, W., Yang, X., Xue, G., Xu, W., Bi, K., Mei, L., Zhang, L., Hou, X., & Chou, X.
(2021). Integration Technology for Wafer-Level LiNbO3 Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing. Nanomaterials, 11(10), 2554.
https://doi.org/10.3390/nano11102554
