Selected Papers from 29th International Conference on Mixed Design of Integrated Circuits and Systems—MIXDES 2022
A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "F1: Electrical Power System".
Deadline for manuscript submissions: closed (31 July 2023) | Viewed by 4329
Special Issue Editors
Interests: power electronics; power converters; wireless power transfer; energy storage technology; magnetic elements; modelling electronic components and systems; IGBT; MOSFET; BJT; power LEDs; electrothermal analysis
Special Issues, Collections and Topics in MDPI journals
Interests: VLSI circuits; HDL modelling; distributed information systems
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Special Issue Information
Dear Colleagues,
The MIXDES conference series began in 1994 and has since been organized annually in major Polish cities. The conference has been held annually without any interruption and gathers participants from more than 25 countries. The MIXDES conference is one of the largest in this field in Central Europe, encompassing interdisciplinary research in design, modeling, simulation, testing, and manufacturing in various areas, such as micro- and nanoelectronics, semiconductors, sensors, actuators, biomedical applications, and power devices. The main organizer of all of these conferences is the Department of Microelectronics and Computer Science of the Technical University of Lodz, Poland, headed by Prof. Andrzej Napieralski.
This Special Issue presents extended versions of selected papers from MIXDES 2022—29th International Conference on Mixed Design of Integrated Circuits and Systems that will be held on 23–24 June 2022.
The issue topics include:
- Integrated Circuits and Microsystems
- Thermal Issues in Microelectronics
- Microelectronics Technology and Packaging
- Testing and Reliability
- Power Electronics
- Signal Processing
- Embedded Systems
- Medical Applications of Microsystems
Prof. Dr. Krzysztof Górecki
Dr. Mariusz Orlikowski
Guest Editors
Manuscript Submission Information
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Keywords
- mixed design
- integrated circuits and systems
- embedded systems
- modelling
- signal processing
- technology
- packaging
- testing
- reliability
- medical applications
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