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Latest Advances in Electrothermal Models II
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Latest Advances in Electrothermal Models II

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J: Thermal Management".

Deadline for manuscript submissions: closed (30 November 2021) | Viewed by 14809

Special Issue Editors

Prof. Dr. Krzysztof Górecki

E-Mail Website
Guest Editor
Department of Marine Electronics, Faculty of Electrical Engineering, Gdynia Maritime University, Morska 83, 81-225 Gdynia, Poland
Interests: power electronics; power converters; wireless power transfer; energy storage technology; magnetic elements; modelling electronic components and systems; IGBT; MOSFET; BJT; power LEDs; electrothermal analysis
Special Issues, Collections and Topics in MDPI journals
Dr. Paweł Górecki

E-Mail Website
Guest Editor
Department of Marine Electronics, Gdynia Maritime University, 81-225 Gdynia, Poland
Interests: power electronics; modelling; thermal phenomena; IGBTs; semiconductor devices
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues, 

For many years, tendencies to miniaturize electronic circuits and to increase power density dissipated in these circuits have been observed. During operation of electronic components, their internal temperature increases due to self-heating phenomena and mutual thermal couplings between components located on the common base. An increase in the device’s internal temperature causes changes in the characteristics of electronic components and also causes a decrease of the life time of these components. 

Therefore, one of the biggest problems of the present electronics is accurate calculation values of internal temperature of such components. Solving this task requires accurate models of the considered components and circuits, which take into account all important physical phenomena occurring in these components and circuits. Models including both electrical and thermal phenomena are called electrothermal models. Such types of models have been described in literature for the last 50 years, but development of electronic technology also causes a development of electrothermal models of electronic components. New versions of such a class of models have different forms and are dedicated to different programs for a computer analysis of electronic circuits, and they could also make it possible to shorten the duration time of calculations. An effective electrothermal analysis also requires effective methods of estimation of parameter values existing in the used models. 

In recent years, we have been able to observe the dynamic development of the abovementioned electrothermal models. This Special Issue of Energies is devoted to the latest advances in this area.

Prof. Dr. Krzysztof Górecki
Dr. Paweł Górecki
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Modeling
  • Compact electrothermal models
  • 2D and 3D electrothermal models
  • Thermal phenomena
  • Self-heating
  • Mutual thermal couplings
  • Electronic components
  • Computer simulations
  • Cooling systems
  • Parameter estimation

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Published Papers (6 papers)

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Research

20 pages, 4192 KiB  
Article
The Embedded System to Control the Illuminance of an Office Workplace with LED Light Sources
by Krzysztof Górecki, Przemysław Ptak and Sylwia Wnuczko
Energies 2022, 15(7), 2406; https://doi.org/10.3390/en15072406 - 25 Mar 2022
Cited by 3 | Viewed by 3069
Abstract
In the paper, an embedded system dedicated to control lighting of the workplace is proposed. The construction of the considered lighting system with a power LED (Light Emitting Diode) and the idea of its control are presented. Some results of investigations of the [...] Read more.
In the paper, an embedded system dedicated to control lighting of the workplace is proposed. The construction of the considered lighting system with a power LED (Light Emitting Diode) and the idea of its control are presented. Some results of investigations of the constructed lighting system, particularly those of the measurements of its optical and electrical parameters, are shown and discussed. The presented results show that by using this system, it is possible to obtain a high value of lighting uniformity in the workplace at different values of the main lighting in the room. The control is fast, and none of the reaction times achieved during the tests exceeded even 1 s while ensuring a smooth change. Although the layout and algorithms used are simple, it can be considered an advantage as they do not introduce unnecessary complexity while meeting all the requirements of standards. A discussion of the obtained results is given, particularly in the range of energy savings. Full article
(This article belongs to the Special Issue Latest Advances in Electrothermal Models II)
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12 pages, 1894 KiB  
Article
Optimal Temperature Regulation of Integrated Circuits with Peltier Heat Pumps
by Gilbert De Mey, Andrzej Kos and Krzysztof Górecki
Energies 2022, 15(3), 1125; https://doi.org/10.3390/en15031125 - 3 Feb 2022
Cited by 6 | Viewed by 2279
Abstract
A thermal network will be presented to model a multi-layer structure consisting of a semiconductor structure, integrated Peltier heat pump and a cooling fin. A criterion will be set up to determine the optimal Peltier current to minimise the chip temperature using the [...] Read more.
A thermal network will be presented to model a multi-layer structure consisting of a semiconductor structure, integrated Peltier heat pump and a cooling fin. A criterion will be set up to determine the optimal Peltier current to minimise the chip temperature using the power dissipation as the control parameter. Compared with classical methods, the proposed solution does not show any time delays in response to power changes and is not sensitive to the position of chip temperature sensors. It does not generate chip temperature oscillations. The idea can be applied in each integrated circuit cooled with Peltier heat pumps, e.g., power devices, high-performance processors, high-frequency integrated circuits, etc. The authors present a simple mathematical formula that can be easily implemented in the software of a processor being cooled. As a consequence, the device is able to operate with maximum efficiency assuming required reliability. Theoretical considerations are illustrated by some results of computations. The paper is addressed to designers involved in the creation of devices dissipating a significant amount of heat energy. Full article
(This article belongs to the Special Issue Latest Advances in Electrothermal Models II)
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20 pages, 6076 KiB  
Article
Electrothermal Model of Coupled Inductors with Nanocrystalline Cores
by Kalina Detka and Krzysztof Górecki
Energies 2022, 15(1), 224; https://doi.org/10.3390/en15010224 - 29 Dec 2021
Cited by 7 | Viewed by 1721
Abstract
The paper proposes a new electrothermal model of a coupled inductor containing a nanocrystalline core dedicated to the analysis of electrical energy conversion systems. The formulated model has a form of a subcircuit for SPICE. The model takes into account the influence of [...] Read more.
The paper proposes a new electrothermal model of a coupled inductor containing a nanocrystalline core dedicated to the analysis of electrical energy conversion systems. The formulated model has a form of a subcircuit for SPICE. The model takes into account the influence of direct current, frequency, skin effect, temperature, self-heating, and mutual thermal couplings on the parameters and characteristics of the coupled inductors. The form of the developed model and the method of model parameter estimation are presented. The applied measuring system is presented. The results of measurements and calculations made with the use of the proposed model are presented and commented on. Full article
(This article belongs to the Special Issue Latest Advances in Electrothermal Models II)
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14 pages, 830 KiB  
Article
Optimization-Based Network Identification for Thermal Transient Measurements
by Nils J. Ziegeler, Peter W. Nolte and Stefan Schweizer
Energies 2021, 14(22), 7648; https://doi.org/10.3390/en14227648 - 16 Nov 2021
Cited by 4 | Viewed by 2266
Abstract
Network identification by deconvolution is a proven method for determining the thermal structure function of a given device. The method allows to derive the thermal capacitances as well as the resistances of a one-dimensional thermal path from the thermal step response of the [...] Read more.
Network identification by deconvolution is a proven method for determining the thermal structure function of a given device. The method allows to derive the thermal capacitances as well as the resistances of a one-dimensional thermal path from the thermal step response of the device. However, the results of this method are significantly affected by noise in the measured data, which is unavoidable to a certain extent. In this paper, a post-processing procedure for network identification from thermal transient measurements is presented. This so-called optimization-based network identification provides a much more accurate and robust result compared to approaches using Fourier or Bayesian deconvolution in combination with Foster-to-Cauer transformation. The thermal structure function obtained from network identification by deconvolution is improved by repeatedly solving the inverse problem in a multi-dimensional optimization process. The result is a non-diverging thermal structure function, which agrees well with the measured thermal impedance. In addition, the associated time constant spectrum can be calculated very accurately. This work shows the potential of inverse optimization approaches for network identification. Full article
(This article belongs to the Special Issue Latest Advances in Electrothermal Models II)
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16 pages, 765 KiB  
Article
Quantitative Performance Comparison of Thermal Structure Function Computations
by Nils J. Ziegeler, Peter W. Nolte and Stefan Schweizer
Energies 2021, 14(21), 7068; https://doi.org/10.3390/en14217068 - 28 Oct 2021
Cited by 7 | Viewed by 2449
Abstract
The determination of thermal structure functions from transient thermal measurements using network identification by deconvolution is a delicate process as it is sensitive to noise in the measured data. Great care must be taken not only during the measurement process but also to [...] Read more.
The determination of thermal structure functions from transient thermal measurements using network identification by deconvolution is a delicate process as it is sensitive to noise in the measured data. Great care must be taken not only during the measurement process but also to ensure a stable implementation of the algorithm. In this paper, a method is presented that quantifies the absolute accuracy of network identification on the basis of different test structures. For this purpose, three measures of accuracy are defined. By these metrics, several variants of network identification are optimized and compared against each other. Performance in the presence of noise is analyzed by adding Gaussian noise to the input data. In the cases tested, the use of a Bayesian deconvolution provided the best results. Full article
(This article belongs to the Special Issue Latest Advances in Electrothermal Models II)
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18 pages, 2251 KiB  
Article
Accurate Circuit-Level Modelling of IGBTs with Thermal Phenomena Taken into Account
by Paweł Górecki, Krzysztof Górecki and Janusz Zarębski
Energies 2021, 14(9), 2372; https://doi.org/10.3390/en14092372 - 22 Apr 2021
Cited by 10 | Viewed by 2104
Abstract
This paper proposes a new compact electrothermal model of the Insulated Gate Bipolar Transistors (IGBT) dedicated for SPICE (Simulation Program with Integrated Circuit Emphasis). This model makes it possible to compute the non-isothermal DC characteristics of the considered transistor and the waveforms of [...] Read more.
This paper proposes a new compact electrothermal model of the Insulated Gate Bipolar Transistors (IGBT) dedicated for SPICE (Simulation Program with Integrated Circuit Emphasis). This model makes it possible to compute the non-isothermal DC characteristics of the considered transistor and the waveforms of terminal voltages and currents of the investigated device and its internal temperature at transients. This model takes into account the nonlinearity of thermal phenomena in this device. The form of the formulated model is described and the problem of estimating its parameter values is discussed. The correctness of the proposed model was verified experimentally both at DC operation and at transients. The obtained results are compared to the results of computations performed with the use of the classical literature model. A very good agreement between the results of measurements and computations performed with the new model is obtained at different cooling conditions and in a wide range of changes of parameters characterising the electrical excitation of the tested device. Full article
(This article belongs to the Special Issue Latest Advances in Electrothermal Models II)
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