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Micromachines
Special Issues
Advances in Sensors and Electronic Instrumentation 2024
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Advances in Sensors and Electronic Instrumentation 2024

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: 31 December 2024 | Viewed by 5561

Special Issue Editors

Dr. Sergey Y. Yurish

E-Mail Website
Guest Editor
International Frequency Sensor Association (IFSA), 08860 Castelldefels, Spain
Interests: smart sensors; optical sensors; frequency measurements
Special Issues, Collections and Topics in MDPI journals
Dr. Muhammad Ali Butt

E-Mail Website
Guest Editor
Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, 00-662 Warsaw, Poland
Interests: integrated photonics; plasmonics; fiber-optic sensors; metasurfaces; wearable sensors
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The 10th Annual International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2024) is a forum for the presentation, discussion, and exchange of information and the latest research and development results in both theoretical and experimental research in sensors, transducers, and their related fields, including artificial intelligence-based sensors and sensor systems. It brings together researchers, developers, and practitioners from diverse fields including international scientists and engineers from academia, research institutes, and companies to present and discuss the latest results in the field of sensors and measurements.

After successful events in 2015 (Dubai, UAE), 2016 (Barcelona, Spain), 2017 (Moscow, Russia), 2018 (Amsterdam, the Netherlands), 2019 (Tenerife (Canary Islands), Spain), 2020 (Porto, Portugal), 2021 (Palma de Mallorca (Balearic Islands), Spain), 2022 (Corfu, Greece), and 2023 (Funchal (Madeira Island), Portugal), the SEIA' 2024 will take place in Ibiza (Balearic Islands) on 25–27 September 2024 in co-location with the 6th IFSA Frequency and Time Conference (IFTC' 2024) and the 6th International Conference on Microelectronic Devices and Technologies (MicDAT '2024) under the same conference umbrella in-person format.

This Special Issue contains extended papers from SEIA' 2024 (https://seia-conference.com/) and MicDAT '2024 (https://www.micdat-conference.com/).

In addition, submissions from others that are not associated with these two conferences but with themes focusing on sensors and electronic instrumentation are also welcome.

Dr. Sergey Y. Yurish
Dr. Muhammad Ali Butt
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microelectronic devices
  • optoelectronics
  • sensors
  • transducers
  • measuring instrumentation
  • MEMS
  • NEMS
  • electronics
  • plasmonics
  • metasurfaces
  • wearables
  • neuromorphic computing
  • photonic neural networks

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Further information on MDPI's Special Issue polices can be found here.

Published Papers (2 papers)

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17 pages, 5362 KiB  
Article
Design of Miniaturized 90-Degree Hybrid Coupler with Wide Rejection Band Using Neural Network
by Golshan Mohamadpour, Salman Karimi and Saeed Roshani
Micromachines 2024, 15(5), 657; https://doi.org/10.3390/mi15050657 - 17 May 2024
Cited by 1 | Viewed by 1090
Abstract
In this paper, a 3 dB 90-degree hybrid coupler with size reduction and harmonics rejection was designed. In the proposed coupler structure, four simple low-pass filters (LPFs) were applied. An artificial neural network (ANN) was used to determine the dimensions of the applied [...] Read more.
In this paper, a 3 dB 90-degree hybrid coupler with size reduction and harmonics rejection was designed. In the proposed coupler structure, four simple low-pass filters (LPFs) were applied. An artificial neural network (ANN) was used to determine the dimensions of the applied LPFs based on EM simulation data. The applied ANN model could also provide the desired LPF parameters, including the cut-off frequency (fc), bandwidth (BW), and insertion loss (IL). Designing an applied LPF involves complex mathematical calculations and simulations to optimize parameters. However, by utilizing neural networks, the design process can be significantly streamlined and automated. Neural networks have the ability to learn complex patterns and relationships within data, making them well suited for optimizing the performance of applied components. The proposed 90-degree hybrid coupler works correctly at 1800 MHz and has a small size of 16.6 mm × 15.15 mm, which provides a 73% size reduction compared to a normal 1800 MHz coupler. The designed coupler not only decreases the circuit size but also provides a wide rejection band from 4.8 GHz to 11.2 GHz, which suppresses the second to sixth harmonics. The insertion loss parameter of this 90-degree hybrid coupler is less than 0.1 dB at the working frequency, which shows the superior performance of the proposed coupler. Full article
(This article belongs to the Special Issue Advances in Sensors and Electronic Instrumentation 2024)
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11 pages, 2654 KiB  
Article
Racetrack Ring Resonator-Based on Hybrid Plasmonic Waveguide for Refractive Index Sensing
by Muhammad A. Butt
Micromachines 2024, 15(5), 610; https://doi.org/10.3390/mi15050610 - 30 Apr 2024
Cited by 5 | Viewed by 1294
Abstract
In this study, a comprehensive numerical analysis is conducted on a hybrid plasmonic waveguide (HPWG)-based racetrack ring resonator (RTRR) structure, tailored specifically for refractive index sensing applications. The sensor design optimization yields remarkable results, achieving a sensitivity of 275.7 nm/RIU. Subsequently, the boundaries [...] Read more.
In this study, a comprehensive numerical analysis is conducted on a hybrid plasmonic waveguide (HPWG)-based racetrack ring resonator (RTRR) structure, tailored specifically for refractive index sensing applications. The sensor design optimization yields remarkable results, achieving a sensitivity of 275.7 nm/RIU. Subsequently, the boundaries of sensor performance are pushed even further by integrating a subwavelength grating (SWG) structure into the racetrack configuration, thereby augmenting the light–matter interaction. Of particular note is the pivotal role played by the length of the SWG segment in enhancing device sensitivity. It is observed that a significant sensitivity enhancement can be obtained, with values escalating from 377.1 nm/RIU to 477.7 nm/RIU as the SWG segment length increases from 5 µm to 10 µm, respectively. This investigation underscores the immense potential of HPWG in tandem with SWG for notably enhancing the sensitivity of photonic sensors. These findings not only advance the understanding of these structures but also pave the way for the development of highly efficient sensing devices with unprecedented performance capabilities. Full article
(This article belongs to the Special Issue Advances in Sensors and Electronic Instrumentation 2024)
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