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Collection of Silicon Detectors Mechanical Properties from Static and Dynamic Characterization Test Campaigns
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Edoardo Mancini, Lorenzo Mussolin, Giulia Morettini, Massimiliano Palmieri, Maria Ionica, Gianluigi Silvestre, Franck Cadoux, Agnese Staffa, Giovanni Ambrosi, Filippo Cianetti, Claudio Braccesi, Lucio Farnesini, Mirco Caprai, Gianluca Scolieri, Roberto Petrucci and Luigi Torre
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Abstract
Physics research is constantly pursuing more efficient silicon detectors, often trying to develop complex and optimized geometries, thus leading to non-trivial engineering challenges. Although critical for this optimization, there are few silicon tile mechanical data available in the literature. In an attempt to
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Physics research is constantly pursuing more efficient silicon detectors, often trying to develop complex and optimized geometries, thus leading to non-trivial engineering challenges. Although critical for this optimization, there are few silicon tile mechanical data available in the literature. In an attempt to partially fill this gap, the present work details various mechanical-related aspects of spaceborne silicon detectors. Specifically, this study concerns three experimental campaigns with different objectives: a mechanical characterization of the material constituting the detector (in terms of density, elastic, and failure properties), an analysis of the adhesive effect on the loads, and a wirebond vibrational endurance campaign performed on three different unpotted samples. By collecting and discussing the experimental results, this work aims to fulfill its purpose of providing insight into the mechanical problems associated with this specific application and procuring input data of paramount importance. For the study to be complete, the perspective taken is broader than mere silicon analysis and embraces all related aspects; i.e., the detector–structure adhesive interface and the structural integrity of wirebonds. In summary, this paper presents experimental data on the material properties of silicon detectors, the impact of the adhesive on the gluing stiffness, and unpotted wirebond vibrational endurance. At the same time, the discussion of the results furnishes an all-encompassing view of the design-associated criticalities in experiments where silicon detectors are employed.
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